Recombination Current Density Research Articles

Enhancing dielectric-silicon interfaces through surface electric fields during firing

Minimising charge losses at silicon interfaces is a major development area for highly efficient solar cells. Here we report on the interface improvements achieved by establishing a surface electric field during low-temperature firing of dielectric thin films. By inducing a corona electric field on the surface of a thin film stack, we observe significant modifications to the silicon-dielectric interface upon annealing, which correlate with the characteristics of interface defects. The passivation properties of the interfaces strongly depend on the polarity and strength of the electric field during firing, as well as the dielectric materials in the layer stack. We show that the surface electric fields not only influence surface carrier population but also affect the resulting chemical interface properties post-annealing. It is postulated that hydrogen migration plays a role in these observed effects. Leveraging the corona-induced electric field enables fine-tuning of both the chemical and field-effect passivation in thin film surface dielectrics, resulting in recombination current densities as low as 2.8 fA cm−2 in research-grade float zone silicon, and 14 fA cm−2 in industrial-grade textured silicon. The simplicity and versatility of the thin film electric polarisation enable a new strategy for controlling and exploiting the chemical enhancement of interfaces in solar cell devices, from current TOPCon and PERC devices to future multijunction silicon-based cells.

Plasma-Assisted N2O Oxidation (PANO) in an Industrial Direct Plasma Reactor for TOPCon Production

Plasma-Enhanced Chemical Vapor Deposition (PECVD) is an attractive tool for TOPCon production, as it enables uniformly in situ doped amorphous silicon (a-Si) and dielectric layer depositions with high throughput. However, a lean process requires in situ interfacial oxide growth in the same tool. In this work, we use Plasma-Assisted N2O Oxidation (PANO) in an industrial kHz direct plasma reactor (centrotherm c.PLASMA) to grow the oxide and deposit in situ phosphorus doped a-Si(n) as well as SiNx on asymmetric lifetime samples. Before optimization, the oxide thickness is non uniform on the wafer, and we show that it correlates with the passivation, the contact resistivity, and the doping profile in n-type TOPCon test structures. The passivation seems to benefit more from moderate in-diffusion in the case with PANO than in the case with thermal oxidation. This is probably due to enhanced field-effect passivation compensating for lower chemical passivation, which likely results from plasma-induced damage. After studying the influence of PANO process parameters on the oxide thickness and uniformity, we optimize them to obtain a non-uniformity as low as ±2% and a recombination current density down to 2.3 fA/cm² on planar wafers.

Key Aspects of p-Type TOPCon on Textured Surface for Silicon Bottom Cells in Tandem Devices

Both-sides TOPCon solar cells are an interesting candidate for a highly efficient and thermally robust Silicon (Si) bottom cell for tandem devices, such as Perovskite-Si solar cells. However, preparation of p-type TOPCon on a textured surface is necessary which is particularly challenging. This work aims to gain a deeper understanding of the limiting factors and thereby optimize the SiOx/poly-Si(p) contact to close the gap to its n-type counterpart. Using symmetrical lifetime samples, we first show that a high level of surface passivation can be achieved using thermally grown interfacial oxides of different thicknesses. The samples strongly benefit from an effective thermal activation of hydrogenation by means of fast-firing. Thus, a recombination current density J0s as low as 23.4 fA/cm² was achieved for p-type TOPCon on textured surface featuring an in situ Boron-doped poly-Si layer prepared by plasma enhanced chemical vapor deposition (PECVD). Moreover, we show that the passivation quality strongly depends on surface morphology. Smoothening the random pyramids’ valleys and – what is more – the tips has a positive impact on the surface passivation.

Novel Passivation and Gettering Strategy for Silicon Wafer by Al2O3/n‐poly‐Si/SiOx Stack for High‐Efficiency p‐Type Passivating Tunnel Oxide Contact Solar Cells

This study focuses on the enhanced passivation and gettering of boron‐doped p‐type solar grade silicon wafers by incorporating carrier‐selective and passivating tunnel oxide contact (TOPCon). A symmetrical stack of aluminum oxide (Al2O3)/p‐doped n‐type polysilicon (n‐poly‐Si)/ ultrathin silicon oxide (SiOx) in conjunction with long cycles of forming gas annealing is used for enhancing the silicon wafer quality with a novel approach. Multilayer of n‐poly‐Si/SiOx on p‐type crystalline silicon wafer exhibits an implied open‐circuit voltage (iVoc) of 726 mV, effective carrier lifetime (τeff) of 857 μs, and a low recombination current density (Jo) of 1.9 fA cm−2 when subjected to a postdeposition annealing (PDA) of phosphorus‐doped hydrogenated amorphous silicon (n‐a‐Si:H) at 820 °C. To boost passivation and gettering quality, 10 nm‐thick Al2O3 layers on both sides of n‐poly‐Si/SiOx samples are added. This leads to improved τeff (962 μs), reduced Jo (1.1 fA cm−2), and higher iVoc (728 mV). Herein, a thinner 50 nm n‐poly‐Si layer for improved properties is applied. The experiments show improved passivation and gettering. A Quokka‐3 simulation examines the potential of high‐efficiency p‐type TOPCon cells. A novel solar‐grade p‐type wafer quality enhancement approach is introduced, amalgamated with Quokka‐3 results, which could be a milestone in high‐efficiency p‐type TOPCon solar cell production.

Current status and challenges for hole-selective poly-silicon based passivating contacts

Doped polysilicon (poly-Si) passivating contacts have emerged as a key technology for the next generation of silicon solar cells in mass production, owing to their excellent performance and high compatibility with the existing passivated emitter and rear cell technology. However, the current solar cell architecture based on a rear-side electron-selective (n+) poly-Si contact is also approaching its practical limit (∼26%) in mass production. The full potential of doped poly-Si passivating contacts can only be realized through incorporation of both electron-selective and hole-selective (p+) poly-Si contacts. While studies of both p+ and n+ poly-Si contacts commenced simultaneously, significant performance differences have arisen. Phosphorus-doped poly-Si contacts consistently outperform boron-doped counterparts, displaying typically lower recombination current density (J0) values (1–5fA/cm2 vs 7–15fA/cm2). This discrepancy can be attributed to inadequate optimization of p+ poly-Si contacts and fundamental limitations related to boron doping. The poorer passivation of p+ poly-Si contacts can be at least partly attributed to boron segregation into the interfacial oxide layers, compromising the interfacial oxide integrity and reducing the chemical passivation effectiveness. This review critically examines the progress of p+ poly-Si contacts characterized by cell efficiency and J0 values, delves into existing challenges, identifies potential solutions, and explores some potential solar cell architectures to enhance efficiency by incorporating p+ poly-Si contacts.

Approach to determining the limiting recombination mechanism in CdTe-based solar cells

Determining exactly how the performance of a thin-film photovoltaic device is limited by a particular recombination mechanism can be difficult, particularly in the case of CdTe solar cells. As a result, efforts are being made to improve all parts of the device without good knowledge of which improvements are necessary. To understand where the device limitation is, the recombination current densities of at least one on of the interfaces must be known. Here, we present a method to determine which recombination mechanisms is limiting. First, back illuminated quantum efficiency measurements are used to determine the key parameters of the back interface – the back surface recombination velocity and the band bending near the back surface. Once these back interface parameters are determined, the recombination current densities can be calculated for a front illuminated device to determine the limiting mechanism. The validity of the approach is tested using previously reported data.

Study on selective emitter fabrication through an innovative pre‐diffusion process for enhanced efficiency in TOPCon solar cells

AbstractTOPCon (tunnel oxide passivated contact) solar cell is the mainstream high‐efficiency crystalline silicon solar cell structure. However, the lack of efficient passivation contact mechanisms on the front surface restricts the electrical performance ability to improve further. Selective emitter (SE) technology, considered a potential solution, needs to be more mature. This work provides a unique thermal pre‐diffusion approach combined with laser treatment and post‐oxidation annealing to create SE structures in TOPCon solar cells. Times for the high‐temperature process are equivalent to those for a traditional homogenous emitter. The innovative thermal pre‐diffusion process created a unique boron doping profile, achieving a high surface concentration of nearly 1 × 1020 cm−3 with a shallow junction depth of approximately 0.25 μm. Laser treatment further activated boron and facilitated its diffusion, influenced by the boron silicate glass layer and surface boron atoms. Adjustments were made to improve the pre‐diffusion recipe, including an additional boron deposition step, increasing non‐activated boron atoms. Introducing larger pyramidal microstructures also improved the junction depth and surface concentration in the heavily doped region. Compared to homogeneous emitters, the SE structures exhibited lower surface concentration in the lightly doped region, reducing the recombination current density in the passivation region J0,pass values. The SE structures achieved higher junction depths, limiting metal atom diffusion and reducing the current recombination density in the metal contact region J0,metal values. The contact resistivity between metal and silicon was also decreased. Overall, introducing SE structures resulted in a batch‐average efficiency improvement of 0.26%, reaching an average efficiency of 25.22% for TOPCon solar cells, and has industrial mass‐producible.

Variability of temperature on the electrical properties of heterostructured CIS/Cds through SCAPS simulation for photovoltaic applications

Renewable energy research has received tremendous attention in recent years in a quest to circumvent the current global energy crisis. This study carefully selected and simulated the copper indium sulfur ternary compound semiconductor material with cadmium sulfide owing to their advantage in photovoltaic applications. Despite the potential of the materials in photovoltaic devices, the causes of degradation in the photovoltaic efficiency using such compound semiconductor materials have not really been investigated. However, electrical parameters of the materials such as open circuit voltage, short circuit current density, and fill factor have been extensively studied and reported as major causes of degradation in materials’ efficiency. Furthermore, identifying such electrical characteristics as a primary degradation mechanism in solar cells, this study work is an ardent effort that investigates the materials' electrical behavior as a cure to the degradation associated with compound semiconductor-based photovoltaic. In this study, we numerically characterized the electrical properties such as fill factor, open circuit voltage, short circuit current density, power conversion efficiency, net recombination rate, net generation rate, generation current density, recombination current density, hole current density, electrons current density, energy band diagram, capacitance–voltage, electric field strength of the heterostructured CIS/CdS compound semiconductor material using SCAP-1D. We also investigated the effect of temperature on the electrical properties of heterostructured materials. The obtained results reveal the uniformity of the total current density in the material despite the exponential decrease in the electron current density and the exponential increase in hole current density. The extracted solar cell parameters of the heterostructured CIS/CdS at 300 K are 18.6% for PCE, 64.8% for FF, 0.898 V for Voc, and 32 mA cm−2 for Jsc. After the investigation of the effect of temperature on the CIS/CdS compound semiconductor material, it was observed that the solar cell was most efficient at 300 K. The energy band gap of the CIS/CdS compound semiconductor material shrinks with an increase in temperature. The highest net recombination rate and recombination current is at 400 K, while the net generation rate and generation current density are independent of temperature. The study, on the other hand, gave insights into the potential degradation process, and utilizing the study’s findings could provide photovoltaic degradation remediation.

Thickness-variation-insensitive near-infrared quantum dot LEDs

In terms of tunable luminescence and high quantum efficiency, colloidal quantum dots (CQDs) are promising semiconductors for constructing near-infrared light-emitting diodes (NIR-LEDs). However, currently available NIR-LEDs are susceptible to variations in the emission layer thickness (EMLT), the highest external quantum efficiency (EQE) decreases to below 50% (relative to peak EQE) when the EMLT varies out of a narrow range of (±30 nm). This is due to the thickness-dependent carrier recombination rate and current density variation, resulting in batch-to-batch EQE fluctuations that limit LED reproducibility. Here we report efficient NIR-LEDs that exhibit EQE variations of less than 15% (relative to the champion EQE) over an EMLT range of 40–220 nm; the highest achievable EQE of ∼11.5% was obtained by encapsulating a 212 nm-thick CQD within a type-I inorganic shell to enhance the radiative recombination in the dots, resulting in a high photoluminescence quantum yield of 80%, and by post-treating the films with a bifunctional linking agent to improve and balance the hole and electron mobilities in the entire film (electron mobility: 8.23 × 10−3 cm2 V−1 s−1; hole mobility: 7.0 × 10−3 cm2 V−1 s−1). This work presents the first NIR-LEDs that exhibit EMLT-invariant EQE over an EMLT range of 40–220 nm, which represents the highest EQE among reported CQD NIR-LEDs with a QD thickness exceeding 100 nm.

Detailed investigation of electrical and optical properties of textured n-type and roughened p-type tunnel oxide passivated contacts for screen-printed double-side passivated contact silicon solar cell application

This paper presents detailed characterization and analyses of the optical, electrical, and contact properties of a 35 nm phosphorus-doped (n-type) polysilicon (poly-Si) and a 250 nm boron-doped (p-type) poly-Si deposited respectively on textured and roughed surface. These layers could be applied respectively to the front and rear sides of an n-type Si to produce back junction bifacial screen-printed double-side tunnel oxide passivated contacts (DS-TOPCon) solar cells. Optical and device modeling revealed a short circuit current density loss of 1.5 mA/cm2 and 0.5 mA/cm2 due to absorption in the front n-TOPCon and rear side p-TOPCon layers, respectively. The passivation and contact properties including metalized and unmetallized recombination current density (J0), as well as contact resistivity, were determined as a function of contact firing temperature in the range of 700∼800℃. The passivation quality of the front thin n-TOPCon was found to deteriorate with increased firing temperature while the rear thick p-TOPCon improved. The study showed that the simulated contact firing at 730℃ resulted in the best unmetallized double-side TOPCon precursor, with an excellent implied open-circuit voltage of 730 mV and implied fill factor of ∼86 %. However, the metalized J0 increased and contact resistivity decreased monotonically with the increase in the firing temperature. The 2D device simulations revealed that these layers can produce screen-printed DS-TOPCon cells with an efficiency of ∼22.5 %. Solar cell modeling also showed that the DS-TOPCon solar cell efficiency can reach 24.1 % by decreasing the n-TOPCon thickness to 20 nm and lowering the full area metalized J0 to ∼100 mA/cm2.

On the Robustness of the Determination of Metal‐Induced Recombination from Photoluminescence Images on Solar Cells

The robustness of a recently developed method to obtain the recombination current–density (J0,met) under the front metallization fingers of silicon solar cells is investigated. This method requires a voltage‐calibrated photoluminescence (PL) imaging setup and can be applied on finished solar cells without any dedicated sample preparation. The Fourier‐transform photoluminescence method (FTPL) compares the Fourier spectrum of a PL image with an analytical model to deduce J0,met. It is demonstrated here, from sensitivity analysis, repeated measurements, and case studies, that the method allows to differentiate groups of solar cells having undergone different metallization conditions. Moreover, the comparison of the FTPL method with I–V measurements and with the area‐weighted approach for the J0,met determination shows similar results. Finally, using Quokka modeling, some limitations of the method are identified, and opportunities for improvement are proposed to further enhance this characterization technique.

Regionalizing Nitrogen Doping of Polysilicon Films Enabling High-Efficiency Tunnel Oxide Passivating Contact Silicon Solar Cells.

Tunnel oxide passivating contact (TOPCon) solar cells (SCs) as one of the most competitive crystalline silicon (c-Si) technologies for the TW-scaled photovoltaic (PV) market require higher passivation performance to further improve their device efficiencies. Here, the successful construction of a double-layered polycrystalline silicon (poly-Si) TOPCon structure is reported using an in situ nitrogen (N)-doped poly-Si covered by a normal poly-Si, which achieves excellent passivation and contact properties simultaneously. The new design exhibits the highest implied open-circuit voltage of 755mV and the lowest single-sided recombination current density (J0 ) of ≈0.7 fAcm⁻2 for a TOPCon structure and a low contact resistivity of less than 5 mΩ·cm2 , resulting in a high selectivity factor of ≈16. The mechanisms of passivation improvement are disclosed, which suggest that the introduction of N atoms into poly-Si restrains H overflow by forming stronger Si-N and N-H bonds, reduces interfacial defects, and induces favorable energy bending. Proof-of-concept TOPCon SCs with such a design receive a remarkable certified efficiency of 25.53%.

SiOx/polysilicon selective emitter prepared by PECVD-deposited amorphous silicon plus one-step firing enabling excellent J0,met of < 235 fA/cm2 and ρc of < 2 mΩ·cm2

Boron(B)-doped polysilicon (poly-Si) is the key element to achieve high efficiency and low-cost bifacial tunnel oxide passivated contact (TOPCon) silicon solar cells. In this work, we explore the feasibility of using a plasma-enhanced chemical vapor deposition (PECVD) system to prepare the high-performance poly-Si fingers as selective emitters (poly-finger SE) through depositing nano SiOx and B-doped amorphous silicon plus one-step annealing process. It is found that the poly-finger SE not only reduces the recombination current density under metal contacts (J0,met) from ∼ 1300 fA/cm2 to ∼ 230 fA/cm2, while maintaining a low contact resistivity (ρc) of ∼ 1.6 mΩ·cm2. Additionally, numerical simulations indicate that n-type Si solar cells with poly-finger SE can achieve a high efficiency of 25.36% based on the most advanced device manufacturing technology and the above-mentioned passivation and contact performances. The open-circuit voltage (Voc) increased by 11.1 mV and 4.8 mV compared to controlled and laser SE TOPCon solar cells, manifesting the efficiency increase of 0.39% and 0.20%. Overall, this work presents a new method to enhance the efficiency of TOPCon devices.

Laser Activation for Highly Boron-Doped Passivated Contacts

Passivated, selective contacts in silicon solar cells consist of a double layer of highly doped polycrystalline silicon (poly Si) and thin interfacial silicon dioxide (SiO2). This design concept allows for the highest efficiencies. Here, we report on a selective laser activation process, resulting in highly doped p++-type poly Si on top of the SiO2. In this double-layer structure, the p++-poly Si layer serves as a layer for transporting the generated holes from the bulk to a metal contact and, therefore, needs to be highly conductive for holes. High boron-doping of the poly Si layers is one approach to establish the desired high conductivity. In a laser activation step, a laser pulse melts the poly Si layer, and subsequent rapid cooling of the Si melt enables electrically active boron concentrations exceeding the solid solubility limit. In addition to the high conductivity, the high active boron concentration in the poly Si layer allows maskless patterning of p++-poly Si/SiO2 layers by providing an etch stop layer in the Si etchant solution, which results in a locally structured p++-poly Si/SiO2 after the etching process. The challenge in the laser activation technique is not to destroy the thin SiO2, which necessitates fine tuning of the laser process. In order to find the optimal processing window, we test laser pulse energy densities (Hp) in a broad range of 0.7 J/cm2 ≤ Hp ≤ 5 J/cm2 on poly Si layers with two different thicknesses dpoly Si,1 = 155 nm and dpoly Si,2 = 264 nm. Finally, the processing window 2.8 J/cm2≤ Hp ≤ 4 J/cm2 leads to the highest sheet conductance (Gsh) without destroying the SiO2 for both poly Si layer thicknesses. For both tested poly Si layers, the majority of the symmetric lifetime samples processed using these Hp achieve a good passivation quality with a high implied open circuit voltage (iVOC) and a low saturation current density (J0). The best sample achieves iVOC = 722 mV and J0 = 6.7 fA/cm2 per side. This low surface recombination current density, together with the accompanying measurements of the doping profiles, suggests that the SiO2 is not damaged during the laser process. We also observe that the passivation quality is independent of the tested poly Si layer thicknesses. The findings of this study show that laser-activated p++-poly Si/SiO2 are not only suitable for integration into advanced passivated contact solar cells, but also offer the possibility of maskless patterning of these stacks, substantially simplifying such solar cell production.

High-efficiency n-TOPCon bifacial solar cells with selective poly-Si based passivating contacts

Improving the conversion efficiency of n-TOPCon solar cell is still a hot topic. The selective poly-Si based passivating contacts (Poly-SEs) are ideal candidates for reducing the parasitic absorption and contact resistivity of n-type silicon solar cells and for providing better current collection. In this work, we used LPCVD and the POCl3 tube furnace diffusion methods to fabricate the selective poly-Si based passivating contacts, and studied the influences of key process parameters of the SiOx layer formation process (the oxidation duration (toxidation) and the constant pressure duration (tpressure)), and POCl3 tube diffusion process parameters (the POCl3-N2 carrier gas flow rate at the deposition, deposition temperature, drive-in temperature) on the n+-poly-Si profiles, recombination current density (J0), contact resistivity (ρc) of n-TOPCon solar cells. The results showed that the toxidation and tpressure had a significant impact on J0 and ρc which were mainly related to the distribution number of O and Si4+ content on the growth of the SiOx layer. And the influence of the drive-in temperature of phosphorus (P) diffusion process on J0 value is stronger than that of the deposition temperature, which was mainly related to the chemical passivation of SiOx layer induced by P-indiffusion into Si at high temperature. The reduction in the thickness of poly-Si from 110 nm to 30 nm led to an increase in the short-circuit current density (Jsc) per nanometer of ∼0.0093 mA/cm2 per nm. The Poly-SEs were fabricated by 3D printing mask technology and secondary LPCVD/phosphorus diffusion with J0, n+ ≈ 5 fA/cm2 (n+-poly-Si layer ≈ 50 nm) and J0, metal,n++ ≈ 73.8 fA/cm2 (n++-poly-Si layer ≈ 110 nm), and the efficiency was improved by 0.12% owing to the increase in Jsc value of 0.28 mA/cm2. After optimizing the passivation process, the industrial-grade TOPCon bifacial cells reached an efficiency (Eff), Voc, Jsc, and FF values as high as 25.4%, 721 mV, 42.2 mA/cm2, and 83.5%, respectively.

A study of activated phosphorus distribution within silicon substrate for polysilicon passivating contacts based on an in-line PVD system

An in-line PVD system consisting of plasma oxidation chamber and phosphorus-doped amorphous silicon deposition chamber was used to fabricate highly-doped polysilicon passivating contact structure for commercial TOPCon solar cells, which can help to achieve simple fabrication process and excellent electrical properties. In this paper, we studied how the doping profiles of ionized phosphorus atoms in the passivating contact formed by this method varies with the deposition conditions, especially the in-diffusion profile in the silicon substrate. Increasing the RF power of plasma oxidation can prevent phosphorus from penetrating through SiOx to form a shallow profile, and reducing the power is conducive to the formation of more pinholes on SiOx, resulting in a wide profile following the shallow profile. The shallow profile effectively inhibits the surface recombination rate and thus achieve good passivation quality, while the emergence of the following wide profile helps to reduce the contact resistivity by providing more majority carrier transport channels. The 100 W condition constructed a shallow and gradually widening doping profile, exhibiting a low recombination current density of 16.5 fA/cm2 and a low contact resistivity of 1.87 mΩ·cm2. However, the SiOx thickness and density obtained at 80 W are insufficient for achieving a shallow-first-then-widen doping profile, even with adjustments to thermal activation conditions. Additionally, we found the engineering of surface microstructure on silicon wafers also has an impact on the doping profile.

Ion‐Charged Dielectric Nanolayers for Enhanced Surface Passivation in High Efficiency Photovoltaic Devices

AbstractThe power conversion efficiency of solar cells is strongly impacted by an unwanted loss of charge carriers occurring at semiconductor surfaces and interfaces. Here the use of ion‐charged oxide nanolayers to enhance the passivation of silicon surfaces via the field effect mechanism is reported. The first report of enhanced passivation from rubidium and cesium ion‐charged oxide nanolayers is provided. The charge state and formation energy of ion‐charged silicon dioxide are calculated from first principles. Ion embedding is demonstrated and exploited to control the interface population of carriers and minimize electron‐hole pair recombination. The passivation quality directly improves with charge concentration, yet excess ions can produce detrimental interface states. An optimal ionic charge concentration of ≈1.5 × 1012 q cm−2 is deduced, and a recombination velocity and current density as low as 2.8 cm s−1 and 7.8 fA cm−2 are achieved at the Si‐SiO2 interface. Maximized charge is shown to provide efficiency improvements as high as 0.7% absolute. This work provides a unique route to enhance passivation without compromising the film synthesis, thus retaining the antireflection and hydrogenation film properties. As such, ion‐charged dielectrics provide complementary paths for surface and interface optimization in future single‐junction and tandem solar cells.

Engineering Silicon Interfaces with Transparent AlyTiOx/ZnO/TiO2 Stack Exhibiting Exceptional Passivating Contact Performance

AbstractPassivating contact technologies are essential for fabricating high‐efficiency crystalline silicon (c‐Si) solar cells, and their application and incorporation into manufacturing lines has ranked as a hot topic of research. Generally, ideal passivating contacts should combine excellent electrical contact, outstanding surface passivation, and high optical transparency. However, addressing all these criteria concurrently is challenging since it is unlikely for any single material to exhibit both efficient carrier transport and surface‐defect passivation while demonstrating negligible parasitic absorption. In this work, several earth‐abundant, wide‐bandgap materials are combined to engineer high‐quality transparent electron‐selective passivating contact structures capable of overcoming these obstacles. A highly transparent AlyTiOx/ZnO/TiO2 stack with a total thickness of 3 nm, prepared by atomic layer deposition, is shown to provide a close‐to‐ideal passivating contact to Si surfaces by enabling dual functions of remarkable silicon surface passivation (with an effective minority carrier lifetime of 12.3 ms, an implied open‐circuit voltage of 730 mV, and a surface recombination current density prefactor of 2.6 fA cm−2), combined with efficient carrier transport with a very low contact resistivity of 3.4 mΩ cm2. These results demonstrate that low‐cost silicon interface‐engineering strategiesbased on transition metal oxides can push c‐Si solar cell performance to its theoretical limits.

Pre-annealing for improved LPCVD deposited boron-doped poly-Si hole-selective contacts

We demonstrate the beneficial effect of a pre-annealing step prior to the boron diffusion on passivation and contact resistivity of industrially LPCVD deposited poly-Si/SiOX hole-selective contacts. We investigate the influence of the pre-annealing temperature on passivation quality, measured as implied open-circuit voltage and recombination current density, and on changes in crystallinity, characterized by Raman spectroscopy. A clear increase in passivation quality is observed on planar and textured surfaces as well as for various poly-Si thicknesses (100–230 nm) and thermal SiOX growth temperatures (600–800 °C). On planar surfaces and without the use of atomic hydrogenation, we report an increase in iVOC of around 5 mV with every additional increase of pre-annealing temperature by 50 °C (>900 °C) leading to an iVOC of 720 mV (J0 = 9.3 fA/cm2). After atomic hydrogenation, the effect of the pre-annealing is less pronounced. Nevertheless a gain in iVOC (reduction in J0) of 5–10 mV (2–5 fA/cm2) is achieved when comparing samples without pre-annealing with samples after a pre-annealing at 1050 °C. On textured surfaces on the other hand, this trend is more pronounced after atomic hydrogenation, for which a pre-crystallisation at 1050 °C leads to an iVOC (J0) of 705 mV (16.8 fA/cm2), which is a gain (reduction) of 24 mV (21.7 fA/cm2) compared to samples without a pre-annealing step.

Analysis of variation in recombination characteristics due to light and heat in industrial silicon solar cells

This work presents a comprehensive analysis of the variation in performance parameters of monocrystalline and multicrystalline silicon solar cells when subjected to illumination at elevated temperature. Higher degradation and better regeneration in performance parameters namely open circuit voltage (VOC), short circuit current density (JSC) and fill factor (FF) are observed for monocrystalline solar cells. Suns-VOC measurement clearly indicate that the recombination current densities within the space charge region (J02) and rest of the solar cells (J01) together play an important role in light and elevated temperature induced degradation (LeTID) and subsequent regeneration characteristics. During the degradation phase, both J01 and J02 changed significantly for monocrystalline and multicrystalline solar cells. During regeneration, even though J01 improved for both the types of solar cells, notable reduction in J02 was observed only for monocrystalline solar cells. FF loss analysis shows that the recombination in the space charge region is majorly responsible for degradation and regeneration in FF. In contrast to most of the previous studies, we report similar reduction in external quantum efficiency (EQE) at 984 nm, 877 nm and 658 nm and propose that the formation of defects related to LeTID are not only in the deep bulk, but are distributed throughout the bulk. Absence of any improvement in EQE after prolonged exposure to light and heat suggests that defect transformation and gettering are not sufficient enough to regenerate JSC in multicrystalline solar cells. EQE maps at 407 nm suggest that LeTID behavior of emitter is different from that of bulk.